The XCT8500 industrial universal X-ray inspection system consists of an X-ray source, detector, scanning system, image reconstruction and analysis system. It can realize inspection methods such as 2D/3D/CT and is suitable for quality inspection, 3D measurement and non-destructive analysis. Characterization of micro-scale characteristics of internal structure of sample, combined with qualitative and quantitative analysis software to realize multi-angle measurement and analysis of sample, as well as automatic determination of OK/NG conditions and provide effective data for product quality inspection.
It can be used for solder quality inspection of electronic components, BGA components, integrated circuit (IC) and its bond line, semiconductor package and internal connection inspection, electronic power module (IGBT) inspection and wafer defect inspection (WLCSP).
Advantages of the XCT8500 universal X-ray inspection system
- With the planar CT (PCT) function, it can be applied to 3D/CT inspection of printed circuit boards, SMT, IGBT, wafers, etc.
- With the cone beam CT function, it can be applied to the inspection of sensors, relays, micromotors, aluminum materials and castings.
- Convenient 360° fixed point observation.
- 2D gap inspection software module (optional)
- 3D measurement and analysis software module (optional)
Applications
XCT8500 adopts open transmission X-ray source with microfocus, the inspection capacity can reach 0.5μm. It can realize 2D/3D/CT/CT and other inspection methods and is suitable for quality inspection, three-dimensional measurement and non-destructive analysis.
Specifications XCT8500 Universal Universal Industrial X-ray Inspection System
1. X-ray tube parameters
| Tube type | Open microfocus transmission X-ray source |
| Tube voltage range | 20 ~ 160KV |
| Tube current range | 0.01 mA ~ 1.0 mA |
| Maximum tube power | 64W |
| Target maximum power | 15W |
| Minimum object distance (FOD) | < 300 μm |
| Size Micro Focus | < 1 μm |
| Minimum defect inspection capability | < 500 μm |
2. Flat panel detector parameters
| Flat panel type | Amorphous silicon flat panel detector (optional) |
| Pixel matrix | 1536×1536 |
| Field of vision | 154mm×154mm |
| Resolution | 5.0 lp/mm |
| Image frame rate (1×1) | 30 fps |
| AD conversion figures | 16 bits |
3. 3D/CT Parameters (Optional Feature)
| CT scan cycle | 20 s |
| CT reconstruction time | 30 s |
4. Equipment performance parameters
| Maximum sample size | 645mm×635mm |
| Maximum inspection area | 500mm×500mm |
| Geometric image magnification | 2500X |
| Input power supply | 220V 10A 50 - 60HZ |
| Control system | DELL OptiPlex 7000MT v12.0 i9 Graphics Workstation |
| Dimensions | L1500mm×L1650mm×A2250mm |
| Net weight | About 2950 kg |