ZM-R5860 Hot Air BGA Rework Station is a rework station supplied by SeamarkZM, which has three independently controlled temperature zones, convection hot air heating, height adjustable lower temperature zone, high precision autonomous control system, high precision K-type thermocouple with accuracy up to ± 3 ℃, dynamic APR re-loop selective control with multi-flow process. Integrated high power imported high power constant current integrated cooling fan.
As one of the most reputed BGA Rework Station suppliers, SeamarkZM offers the best quality BGA rework station.
Features SeamarkZM ZM R5860 Smart BGA Rework Equipment
- Temperature curve setting
High-definition touch screen operation, real-time display and editing of temperature curves, each group of temperature curves can be set to 8 segments, 100 groups of temperature curves can be stored, with temperature self-organizing function. - Laser red dot positioning guide
Laser indicator for PCB and component positioning. - Vacuum Adsorption
External vacuum suction pen is convenient to take BGA.
Specifications Seamark ZM-R5860 Hot Air BGA Rework Station
| Food | AC220V±10% 50/60HZ |
| Power | 5,0 KW (maximum), upper heating (0,8 KW) lower heating (1,2 KW), preheating IR (2,7 KW), others (0,3 KW) |
| Size | PCB 410370mm (Max); 1010mm (Min) |
| Chip size | BGA 4040mm (Max); 1010mm (Min) |
| Heater size | IR 375285mm |
| Temperature sensor | 1 pcs. |
| Operating method | 7-inch HD touch screen |
| Control system | Autonomous heating control system V1 (software copyright) |
| Alignment system | Laser dot |
| Vacuum absorption | manual |
| Temperature control | Type K thermocouple, Closed-loop control with accuracy up to ±3℃ |
| Location | V-groove with universal fixing |
| Dimensions | L635L620*H655mm |
| Weight | 43.5 kg |
Seamark ZM R5860 BGA machine principle and operation
The SeamarkZM R5860 BGA machine is a rework station used for soldering and desoldering ball grid array (BGA) components onto printed circuit boards (PCBs). BGA components are a type of surface packaging used for integrated circuits.
The SeamarkZM R5860 BGA machine is based on the hot air rework technique. It uses precisely controlled hot air to melt the solder balls of the BGA component, allowing it to be removed or replaced without damaging the PCB or the component itself. The machine also uses a visual alignment system to precisely align the BGA component with the PCB.
The SeamarkZM R5860 BGA allows precise control over temperature and airflow, ensuring a reliable and high quality soldering/de-soldering process. It is suitable for use with a wide range of BGA components and PCBs.
Operating the Seamark ZMR5860 BGA workstation involves several steps:
Preheat: The PCB is preheated to a suitable temperature to prevent thermal shock to the board when hot air is applied.
Alignment: The BGA component is precisely aligned with the PCB using the machine's visual alignment system.
Solder/de-solder: Hot air is applied to the BGA component to melt the solder balls. For desoldering, the component can then be removed. For soldering. The component is placed on the PCB and the solder is allowed to cool and solidify, creating a strong electrical and mechanical connection.
Cooling: the PCB is cooled to room temperature in a controlled manner to prevent thermal stress and warping.