The SMD ZM-R7220A Infrared Rework Station ZM-R7220A is a smart infrared soldering station with real-time temperature monitoring, optical alignment system, fast heating and cooling.
Functions of the R7220A infrared soldering station (ZM R6200)
- Real-time temperature monitoring
Real-time temperature display with automatic curve analysis function. - Optical alignment system
High-definition CCD digital images (2m pixels), automatic optical zoom, manual control and red dot laser alignment. - Fast heating and cooling
The IR preheating zone is heated by a ceramic medium-wave infrared heating plate, a multi-functional movable PCB mounting bracket and a BGA bottom support frame. Integrated laminar fan.
Specification of BGA Infrared Replay Station R7220A IR (ZM R6200C)
| Power supply AC220V±10% 50/60HZ | |
| Power | 5,65 KW (max.), top heater (1,45 KW) bottom heater (1,2 KW), preheater IR (2,7 KW), others (0,3 KW) |
| Size | PCB 412370mm (Max); 66mm (Min) |
| BGA chip size | 6060mm (Max); 22mm (Min) |
| Heater size | IR 285375mm |
| Temperature sensor | 1 pc |
| Operating method | 7-inch HD touch screen |
| Control system | Autonomous heating control system V2 (software copyright) |
| Display system | 15″ industrial SD 15″ display (720P front screen) |
| Alignment system | 2 million pixel SD digital imaging system, automatic optical zoom with laser red dot indicator |
| Automatic vacuum adsorption | |
| Alignment accuracy | ±0.02 mm |
| Temperature control | Thermocouple Type K Control closed-loop thermocouple accurate to ±3℃ |
| Power supply device | no |
| Groove positioning in | V with universal mounting |
| Dimensions | W685L633*H850mm |
| Weight | 76kg |
The difference between a hot air reheat station and a BGA IR infrared reheat station
The main difference between a hot air rework station and a BGA IR rework station is how they heat the board. A hot-air rework station uses heated air to transfer heat from the tool-to-board interface and into the solder balls, while an IR BGA rework station uses infrared light to heat each ball sufficiently so that it melts.
The next important difference is how they control temperature: hot-air rework stations use PID temperature control, but IR BGA rework stations use proportional pressure modulation (PPM). PPM is more precise than PID because it can monitor pressure changes in milliseconds. This means that when you're applying flux to a wafer or reloading solder balls on a wafer, you can respond quickly by adjusting the PPM settings as needed. With PID, this would take about 20 seconds per change due to slow response times in most systems.
Another key difference is in the airflow control systems; the warm air does not need a specialized airflow because there is no need for cooling during backflow, as this all happens outside the furnace chamber using an external fan that blows all zones equally, whether they are near or far from each other.