{"id":2645,"date":"2025-03-17T22:24:38","date_gmt":"2025-03-17T20:24:38","guid":{"rendered":"https:\/\/inventcad.ro\/ro\/?page_id=2645"},"modified":"2025-03-17T22:29:18","modified_gmt":"2025-03-17T20:29:18","slug":"industrial-microfocus-x-ray-3d-ct-machine","status":"publish","type":"page","link":"https:\/\/inventcad.ro\/ro\/produse\/distribuitor-seamarkzm-2\/microfocus-x-ray-inspection-machine\/industrial-microfocus-x-ray-3d-ct-machine\/","title":{"rendered":"Industrial Microfocus X-Ray 3D\/CT Machine"},"content":{"rendered":"\n

Sistemul industrial universal de inspec\u021bie cu raze X XCT8500 const\u0103 dintr-o surs\u0103 de raze X, detector, sistem de scanare, reconstruc\u021bie a imaginii \u0219i sistem de analiz\u0103. Poate realiza metode de inspec\u021bie precum 2D\/3D\/CT \u0219i este potrivit pentru inspec\u021bia calit\u0103\u021bii, m\u0103surarea 3D \u0219i analiza nedistructiv\u0103. Caracterizarea caracteristicilor la scar\u0103 micro ale structurii interne a probei, combinate cu software-ul de analiz\u0103 calitativ\u0103 \u0219i cantitativ\u0103 pentru a realiza m\u0103surarea \u0219i analiza multi-unghi a probei, precum \u0219i determinarea automat\u0103 a condi\u021biilor OK\/NG \u0219i pentru a furniza date eficiente pentru inspec\u021bia calit\u0103\u021bii produsului.<\/p>\n\n\n\n

Poate fi folosit pentru inspec\u021bia calit\u0103\u021bii lipirii componentelor electronice, a componentelor BGA, a circuitului integrat (IC) \u0219i a liniei sale de leg\u0103tur\u0103, inspec\u021bia ambalajului semiconductorului \u0219i conexiunea intern\u0103, inspec\u021bia modulului de putere electronic\u0103 (IGBT) \u0219i inspec\u021bia defectelor de wafer (WLCSP).<\/p>\n\n\n

\n
\"Universal
Universal Industrial X Ray Inspection System<\/figcaption><\/figure>\n<\/div>\n\n\n

Avantajele sistemului universal de inspec\u021bie cu raze X XCT8500<\/h2>\n\n\n\n
    \n
  • Cu func\u021bia CT plan\u0103 (PCT), aceasta poate fi aplicat\u0103 la inspec\u021bia 3D\/CT a pl\u0103cilor de circuite imprimate, SMT, IGBT, wafer-uri etc.<\/li>\n\n\n\n
  • Cu func\u021bia CT cu fascicul conic, poate fi aplicat la inspec\u021bia senzorilor, releelor, micromotoarelor, materialelor \u0219i pieselor turnate din aluminiu.<\/li>\n\n\n\n
  • Mod convenabil de observare cu punct fix de 360\u00b0.<\/li>\n\n\n\n
  • Modul software de inspec\u021bie a golurilor 2D (op\u021bional)<\/li>\n\n\n\n
  • Modul software de m\u0103surare \u0219i analiz\u0103 3D (op\u021bional)<\/li>\n<\/ul>\n\n\n\n

    Aplica\u021bii<\/h2>\n\n\n\n

    XCT8500 adopt\u0103 sursa de raze X cu transmisie deschis\u0103 cu microfocus, capacitatea de inspec\u021bie poate ajunge la 0,5\u03bcm. Poate realiza 2D\/3D\/CT \u0219i alte metode de inspec\u021bie \u0219i este potrivit pentru inspec\u021bia calit\u0103\u021bii, m\u0103surarea tridimensional\u0103 \u0219i analiza nedistructiv\u0103.<\/p>\n\n\n\n

    \"Application
    Application Cases<\/figcaption><\/figure>\n\n\n\n

    Specifica\u021biile XCT8500 Universal Industrial X-ray Inspection System<\/h2>\n\n\n\n

    1. Parametrii tubului cu raze X<\/p>\n\n\n\n

    \n
    \n
    Tip de tub<\/td>Surs\u0103 de raze X de transmisie cu microfocalizare deschis\u0103<\/td><\/tr>
    Gama de tensiune a tubului<\/td>20 ~ 160KV<\/td><\/tr>
    Gama de curent al tubului<\/td>0,01 mA ~ 1,0 mA<\/td><\/tr>
    Putere maxim\u0103 a tubului<\/td>64W<\/td><\/tr>
    Puterea maxim\u0103 \u021bint\u0103<\/td>15W<\/td><\/tr>
    Distan\u021ba minim\u0103 a obiectelor (FOD)<\/td>< 300 \u03bcm<\/td><\/tr>
    Dimensiune Micro Focus<\/td>< 1 \u03bcm<\/td><\/tr>
    Capacitate minim\u0103 de inspec\u021bie a defectelor<\/td>< 500 \u03bcm<\/td><\/tr><\/tbody><\/table><\/figure>\n<\/div><\/div>\n<\/div><\/div>\n\n\n\n

    2. Parametrii detectorului cu ecran plat<\/p>\n\n\n\n

    Tip panou plat<\/td>Detector cu ecran plat cu siliciu amorf (op\u021bional)<\/td><\/tr>
    Matricea de pixeli<\/td>1536\u00d71536<\/td><\/tr>
    C\u00e2mp de vedere<\/td>154mm\u00d7154mm<\/td><\/tr>
    Rezolu\u0163ie<\/td>5,0 lp\/mm<\/td><\/tr>
    Rata de cadre a imaginii (1\u00d71)<\/td>30 fps<\/td><\/tr>
    Cifre de conversie AD<\/td>16 bi\u021bi<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n

    3. Parametri 3D\/CT (Func\u021bie op\u021bional\u0103)<\/p>\n\n\n\n

    Ciclul de scanare CT<\/td>20 s<\/td><\/tr>
    Timp de reconstruc\u021bie CT<\/td> 30 s<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n

    4. Parametrii de performan\u021b\u0103 ai echipamentului<\/p>\n\n\n\n

    Dimensiunea maxim\u0103 a probei<\/td>645mm\u00d7635mm<\/td><\/tr>
    Zona maxim\u0103 de inspec\u021bie<\/td>500mm\u00d7500mm<\/td><\/tr>
    M\u0103rire geometric\u0103 a imaginii<\/td>2500X<\/td><\/tr>
    Alimentare de intrare<\/td>220V 10A 50 – 60HZ<\/td><\/tr>
    Sistem de control<\/td>Sta\u021bie de lucru grafic\u0103 DELL OptiPlex 7000MT v12.0 i9<\/td><\/tr>
    Dimensiuni<\/td>L1500mm\u00d7L1650mm\u00d7A2250mm<\/td><\/tr>
    Greutate net\u0103<\/td>Aproximativ 2950 kg<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n
    \n